Hybrid Metal/Polymer Wafer Bonding Platform
نویسندگان
چکیده
This chapter provides an overview of a hybrid metal/polymer wafer bonding plat-form using damascene-patterned intermediate layers for wafer bonding and elec-trical interconnections. This hybrid bonding platform combines the advantagesof metal-to-metal bonding (for direct electrical interstrata interconnection) andpolymer bonding (for robust thermomechanical wafer bonding strength and sur-face topography accommodation). Copper/benzocyclobutene (Cu/BCB) layers areselected for the demonstration vehicle. A detailed Cu/BCB bonding process base-line is described, and the results obtained are presented. The key issues of hybridmetal/polymer wafer bonding are discussed.hybrid wafer bonding, copper/benzocyclobutene (Cu/BCB) bonding, topographyaccommodation, three-dimensional integration, through-strata via (TSV),bonded interstrata via (BISV)
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